1.

Conference Proceedings
Conference Proceedings
1. SILICON LAYER TRANSFER BY WAFER BONDING
U. Gösele ; Q.-Y. Tong
Pub. info.: Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications.  pp.395-409,  1993.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-29
2.

Conference Proceedings
Conference Proceedings
2. Atomic Layer Deposition on Biological Macromolecules
M. Knez ; K. Nielsch ; A.J. Patil ; S. Mann ; U. Gösele
Pub. info.: Atomic layer deposition applications 2.  pp.219-225,  2007.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(15)
3.

Conference Proceedings
Conference Proceedings
3. Strained Silicon-On-Insulator - Fabrication and Characterization
M. Reiche ; C. Himcinschi ; U. Gösele ; S. Christiansen ; S. Mantl ; D. Buca ; Q. Zhao ; S. Feste ; R. Loo ; D. Nguyen ; W. Buchholtz ; A. Wei ; M. Horstmann ; D. Feijoo ; P. Storck
Pub. info.: Silicon-on-insulator technology and devices 13.  pp.339-344,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 6(4)
4.

Conference Proceedings
Conference Proceedings
4. Volker Lehmann: An Unconventional Scientist
U. Gösele ; H. Föll
Pub. info.: Porous semiconductors : a symposium held in memory of Vitali Parkhutik and Volker Lehmann.  pp.7-20,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(3)