1.

Conference Proceedings
Conference Proceedings
1. PECULIARITIES OF HOT PHOSPHORIC ACID USED IN ETCHING SILICON NITRIDE
Syverson, W. ; Fleming, M.
Pub. info.: Proceedings of the Third International Symposium on Cleaning Technology in Semiconductor Device Manufacturing.  pp.78-84,  1994.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1994-7
2.

Conference Proceedings
Conference Proceedings
2. Studies of the Relationship Between Megasonics, Surface Etching, and Particle Removal in SC-1 Solutions
Cohen, S. L. ; Rath, D. ; Lee, G. ; Furman, B. ; Pope, K. R. ; Tsai, R. ; Syverson, W. ; Gow, C. ; Liehr, M.
Pub. info.: Ultraclean semiconductor processing technology and surface chemical cleaning and passivation : Symposum held April 17-19, 1995, San Francisco, California, USA.  pp.13-,  1995.  Pittsburgh, PA.  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 386
3.

Conference Proceedings
Conference Proceedings
3. THE EFFECTS OF REVERSING WAFER-SURFACE WETTING PROPERTIES OF SULFURIC ACID:HYDROGEN PEROXIDE WAFER-CLEANING SOLUTIONS
Syverson, W. ; Fleming, M. ; Schubring, P.
Pub. info.: Proceedings of the Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing.  pp.60-65,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-20