1.

Conference Proceedings
Conference Proceedings
1. Characterization of Bonded Interface by HF Etching Method
Suni, T. ; Kiihamaeki, J. ; Henttinen, K. ; Suni, I ; Maekinen, J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.70-75,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. Direct Bonding of Thick Film Polysilicon to Glass Substrates
Luoto, H. ; Suni, T. ; Henttinen, K. ; Kulawski, M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.194-204,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
3.

Conference Proceedings
Conference Proceedings
3. SOI Wafers with Buried Cavities
Suni, T. ; Henttinen, K. ; Dekker, J. ; Luoto, H. ; Kulawski, M. ; Makinen, J. ; Mutikainen, R.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.216-225,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
4.

Conference Proceedings
Conference Proceedings
4. Wafer Scale Packaging of MEMS by Using Plasma Activated Wafer Bonding
Suni, T. ; Henttinen, K. ; Lipsainen, A. ; Dekker, J. ; Luoto, H. ; Kulawski, M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.173-183,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
5.

Conference Proceedings
Conference Proceedings
5. Mechanical Delamination for the Materials Integration
Henttinen, K. ; Suni, T. ; Nurmela, A. ; Kulawski, M. ; Suni, I.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.359-367,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
6.

Conference Proceedings
Conference Proceedings
6. Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO2
Suni, T. ; Henttinen, K. ; Suni, I. ; Maekinen, J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.22-30,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27