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Conference Proceedings

1. MEMS IC test probe utilizing fritting contacts

Itoh,T. ; Kataoka,K. ; Engelmann,G. ; Wolf,J. ; Ehrmann,O. ; Reichl,H. ; Suga,T.

Pub. info.:	Design, Test, Integration, and Packaging of MEMS/MOEMS : 9-11 May 2000, Paris, France. pp.244-249, 2000. Bellingham, Wash.. SPIE - The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4019

Conference Proceedings

2. Si/Si Interface Bonded at Room Temperature by Ar Beam Surface Activation

Takagi,H. ; Maeda,R. ; Hosoda,N. ; Suga,T.

Pub. info.:	Intergranular and interphase boundaries in materials : iib98 : proceedings of the 9th International Conference on Intergranular and Interphase Boundaries in Materials (iib98), held in Prague, Czech Republic, July, 1998. pp.341-344, 1999. Zurich-Uetikon, Switzerland. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	294-296

Conference Proceedings

3. Microstructure of Al/α-Al2O3 Interface Fabricated by Surface Activated Bonding at Room Temperature

Akatsu,T. ; Hosoda,N. ; Suga,T. ; Ruhle,M.

Pub. info.:	Intergranular and interphase boundaries in materials : iib98 : proceedings of the 9th International Conference on Intergranular and Interphase Boundaries in Materials (iib98), held in Prague, Czech Republic, July, 1998. pp.329-332, 1999. Zurich-Uetikon, Switzerland. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	294-296