1.

Conference Proceedings
Conference Proceedings
1. Application of Excimer Laser Annealing in the Formation of Implanted Shallow Junctions
Nanver, L.K. ; Goudena, E.J.G. ; Ren, Q.W. ; von de Berg, M. ; Mallee, R. ; Slabbekoorn, J.
Pub. info.: Advances in rapid thermal processing : proceedings of the symposium.  pp.171-178,  1999.  Pennington, N. J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-10
2.

Conference Proceedings
Conference Proceedings
2. 16 Electrical characterization of silicon diodes formed by laser annealing of implanted dopants
Nanver, L. K. ; Slabbekoorn, J. ; Burtsev, A. ; Scholtes, T.L.M. ; Surdeanu, R. ; Simon, F. ; Kalhert, H.-J. ; Slotboom, J. W.
Pub. info.: Advanced short-time thermal processing for Si-based CMOS devices : proceedings of the international symposium.  pp.119-130,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-14
3.

Conference Proceedings
Conference Proceedings
3. Front- to back-wafer overlay accuracy in substrate transfer technologies
van Zeiji, H.W. ; Slabbekoorn, J.
Pub. info.: Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology.  pp.356-367,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-17
4.

Conference Proceedings
Conference Proceedings
4. Waferstepper Alignment For MEMS Applications Using Diffraction Gratings
Zeijl, H.W. van ; Simon, K. ; Slabbekoorn, J. ; Buel, W.v. ; Gui, C.Q.
Pub. info.: BioMEMS and bionanotechnology : symposium held April 1-3, 2002, San Francisco, California, U.S.A..  pp.235-480,  2002.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 729
5.

Conference Proceedings
Conference Proceedings
5. Characterization of waferstepper and process related front- to backwafer overlay errors in bulk micromachining using electrical overlay test structures
van Zeijl, H. W. ; Bijnen, F. G. C. ; Slabbekoorn, J.
Pub. info.: MEMS, MOEMS, and Micromachining.  pp.398-406,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5455
6.

Conference Proceedings
Conference Proceedings
6. 3D align overlay verification using glass wafers
Smeets, E. M. J. ; Bijnen, F. G. C. ; Slabbekoorn, J. ; van Zeijl, H. W.
Pub. info.: MEMS/MOEMS Technologies and Applications II.  pp.152-162,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5641
7.

Conference Proceedings
Conference Proceedings
7. Characterization of front- to backwafer alignment and bulk micromachining using electrical overlay test structures
van Zeijl, H.W. ; Slabbekoorn, J.
Pub. info.: Smart Sensors, Actuators, and MEMS.  2  pp.617-626,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5116