1.

Conference Proceedings
Conference Proceedings
1. Post Copper CMP Cleaning: A Non-Contact Megasonic Method
Eissa, M. ; Joshi, S. ; Shinn, G. ; Rafie, S. ; Fraser, B.
Pub. info.: Chemical mechanical planariarization in IC device manufacturing III : proceedings of the international symposium.  pp.499-505,  1999.  Pennington, N. J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-37
2.

Conference Proceedings
Conference Proceedings
2. Chemical Mechanical Planarization (CMP) Process Windows in Shallow Trench Isolation for Advanced CMOS
Chaterjee, A. ; Kwok, S.P. ; Ali, I. ; Joyner, K. ; Shinn, G. ; Sheng, I.-C.
Pub. info.: Proceedings of the First International Symposium on Chemical Mechanical Planarization.  pp.219-227,  1996.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 96-22
3.

Conference Proceedings
Conference Proceedings
3. Using Variation Decomposition Analysis to Determine the Effect of Process on Wafer- and Die-Level Uniformity in Oxide CMP
Ouma, D. ; Stine, B. ; Divecha, R. ; Boning, D. ; Chung, J. ; Ali, I. ; Shinn, G. ; Islamraja, M.
Pub. info.: Proceedings of the First International Symposium on Chemical Mechanical Planarization.  pp.164-175,  1996.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 96-22