1.

Conference Proceedings
Conference Proceedings
1. Microstructure Evolution of Al-1.5% Cu Alloy as a Function of Resistance Change Due to Isothermal DC Stressing
Lee, T. ; Schade, M. ; Merino, A. ; Lee, J. ; Christenson, C. ; Varker, C. ; Evans, K.
Pub. info.: Materials reliability in microelectronics VIII : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.109-,  1998.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 516
2.

Conference Proceedings
Conference Proceedings
2. Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), and Secondary Ion Mass Spectroscopy (SIMS) Characterization of the Morphology of Aluminum Bond Pads for Surface Reflectivity Applications
Schade, M. ; Ai, R. ; Stein, Y. ; Anderson, T.
Pub. info.: Diagnostic techniques for semiconductor materials processing II : symposium held November 27-30, 1995, Boston, Massachusetts, U.S.A..  pp.425-,  1996.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 406