1.

Conference Proceedings
Conference Proceedings
1. Demonstration of Integral Passives on Double Sided Polyimide Flex*
Nielsen,Matthew ; Cole,H.S. ; Saia,R.J. ; Durocher,K.M. ; Krishnamurthy,N. ; Kapadia,H. ; Lu,T.-M. ; Rymaszewski,E.J. ; Dey,S. ; Shaefer,T. ; Gilbert,B.
Pub. info.: 2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA.  pp.351-356,  2000.  Reston, VA, Bellingham, Wash..  IMAPS — SPIE-The International Society for Optical
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4217
2.

Conference Proceedings
Conference Proceedings
2. Extension of high-density interconnect multichip module technology for MEMS packaging
Butler,J.T. ; Bright,V.M. ; Saia,R.J. ; Comtois,J.H
Pub. info.: Micromachined Devices and Components III.  pp.169-177,  1997.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3224