1.

Conference Proceedings
Conference Proceedings
1. FULL THREE DIMENSIONAL MICROCIRCUIT INTEGRATION TECHNIQUES USING WAFER BONDING
D.B. Booth ; C.B. Hunt ; S. Mani ; S. Glenn
Pub. info.: Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications.  pp.293-302,  1993.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-29
2.

Technical Paper
Technical Paper
2. Output Feedback Adaptive Variable Structure Control of a Smart Projectile Fin
S. Mani ; S. Singh ; W. Yim ; A. Araujo
Pub. info.: AIAA meeting papers on disc.  2006.  Reston, Va.  American Institute of Aeronautics and Astronautics
Title of ser.: AIAA Paper : AIAA Guidance Navigation and Control Conference
Ser. no.: 2006