1.

Conference Proceedings
Conference Proceedings
1. Fabrication of Sub-micron Active Layer SSOI Substrates using Ion Splitting And Wafer Bonding Technologies
Ruddell, F. ; Bain, M. ; Suder, S. ; Hurley, R.E. ; Armstrong, B.M. ; Fusco, V.F. ; Gamble, H.S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.25-30,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. Characteristics and Applications of Silicon Direct Bonded Interfaces
McCann, P. ; Devine, C. ; Ruddell, F. ; Baine, P. ; Gamble, H.S. ; Nevin, W.A.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.154-165,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
3.

Conference Proceedings
Conference Proceedings
3. Electrical and Structural Characterization of Silicon on Silicon Bonded Interfaces
McCann, P. ; MeKeever, J. ; Nicholson, D. ; Ruddell, F. ; Gamble, H.S. ; Nevin, W.A.
Pub. info.: High purity silicon VII : proceedings of the international symposium.  pp.369-376,  2002.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-20