1.

Conference Proceedings
Conference Proceedings
1. Modelling of Grain Structure Evolution and its Impact on the Reliability of Al(Cu) Thin Film Interconnects
Riege, S. P. ; Andleigh, V. ; Thompson, C. V. ; Frost, H. J.
Pub. info.: Semiconductor process and device performance modeling : symposium held December 2-3, 1997, Boston, Massachusetts, U.S.A..  pp.219-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 490
2.

Conference Proceedings
Conference Proceedings
2. Real-Time TEM Studies of Electromigration in Submicron Aluminum Runners
Riege, S. P. ; Hunt, A. W. ; Prybyla, J. A.
Pub. info.: Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A..  pp.249-,  1995.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 391