1.

Conference Proceedings
Conference Proceedings
1. Characterization of ultra thin SOI and SSOI substrates: defect and strain analysis Invited
Bedell, S.W. ; Hovel, H. ; Domenicucci, A. ; Fogel, K. ; Reznicek, A. ; Sadana, D.K.
Pub. info.: Silicon-on-insulator technology and devices XII : proceedings of the international symposium.  pp.345-356,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-03
2.

Conference Proceedings
Conference Proceedings
2. Strain Engineering for Si CMOS Technology (Invited paper)
Sadana, D. K. ; Bedell, S. W. ; Reznicek, A. ; de Souza, J.P. ; Fogel, K. ; Hovel, H.
Pub. info.: ULSI Process Integration : proceedings of the International Symposium.  pp.360-384,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-06
3.

Conference Proceedings
Conference Proceedings
3. (8.6) 5:55 - 6:15 PM Strained-Silcon / Silicbn- Germanium-on-Insulator for High Peformance CMOS - A Manufacturable Process for 300 MM Substrates
Reznicek, A. ; Bedell, S. W. ; Hovel, H. J. ; Fogel, K. E. ; Ott, J. A. ; Mitchell, R. M. ; Sadana, D. K. (IBM)
Pub. info.: SiGe: materials, processing, and devices : proceedings of the First international symposium.  pp.607-618,  2004.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2004-07
4.

Conference Proceedings
Conference Proceedings
4. Development of Nanovoids at Hydrophilic, Hydrophobic and UHV Bonded Silicon Interfaces
Reznicek, A. ; Scholz, R. ; Senz, S. ; Goesele, U.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.221-232,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
5.

Conference Proceedings
Conference Proceedings
5. UHV-Bonding: Electrical Characterization of Interfaces and Application to Magnetoelectronics
Senz, S. ; Reznicek, A. ; Kumar, A. ; Scholz, R. ; Goesele, U.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.48-61,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
6.

Conference Proceedings
Conference Proceedings
6. Electrical and Structural Investigation of Bonded Silicon Interfaces
Reznicek, A. ; Senz, S. ; Breitenstein, O. ; Scholz, R. ; Goesele, U.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.114-125,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27