1.

Conference Proceedings
Conference Proceedings
1. SUNRED:a new field solving approach
Szekely,V. ; Pahi,A. ; Rencz,M.
Pub. info.: Design, test, and microfabrication of MEMS and MOEMS : 30 March-1 April 1999, Paris, France.  Part1  pp.278-288,  1999.  Bellingham, Wash., USA.  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3680
2.

Conference Proceedings
Conference Proceedings
2. Thermal Transient Testing
Szekely,Vladimir ; Rencz,M. ; Courtois,B.
Pub. info.: 1996 International Symposium on Microelectronics : 8-10 October 1996, Minneapolis Convention Center, Minneapolis, Minnesota.  pp.18-23,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2920
3.

Conference Proceedings
Conference Proceedings
3. THERMODEL:a tool for thermal model generation and application for MEMS packages
Szekely,V. ; Rencz,M. ; Poppe,A. ; Courtois,B.
Pub. info.: Design, Test, Integration, and Packaging of MEMS/MOEMS : 9-11 May 2000, Paris, France.  pp.39-49,  2000.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4019
4.

Conference Proceedings
Conference Proceedings
4. From MEMS to the global simulation of SoCs
Rencz,M. ; Szekely,V. ; Poppe,A. ; Courtois,B.
Pub. info.: Design, modeling, and simulation in microelectronics : 28-30 November 2000, Singapore.  pp.9-20,  2000.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4228
5.

Conference Proceedings
Conference Proceedings
5. Compact dynamic thermal multiport models of packages for MEMS-package cosimulation
Rencz,M. ; Szekely,V.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2001 : 25-27 April 2001, Cannes, France.  pp.415-423,  2001.  Bellingham, Washington.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4408
6.

Conference Proceedings
Conference Proceedings
6. Algorithmic and practical questions of electrothermal circuit simulation
Rencz,M. ; Szekely,V. ; Pahi,A. ; Poppe,A.
Pub. info.: Design, characterization, and packaging for MEMS and microelectronics : 27-29 October 1999, Royal Pines Resort, Queensland, Australia.  pp.178-187,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3893
7.

Conference Proceedings
Conference Proceedings
7. Tool and method for the theremal transient evaluation of packages
Szekely,V. ; Rencz,M. ; Courtois,B.
Pub. info.: Design, characterization, and packaging for MEMS and microelectronics : 27-29 October 1999, Royal Pines Resort, Queensland, Australia.  pp.94-103,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3893
8.

Conference Proceedings
Conference Proceedings
8. Microsystem design framework based on tool adaptations and library developments
Karam,J.-M. ; Courtois,B. ; Rencz,M. ; Poppe,A. ; Szekely,V.
Pub. info.: Microlithography and Metrology in Micromachining II.  pp.236-245,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2880
9.

Conference Proceedings
Conference Proceedings
9. ｦﾌS-THERMANAL:an efficient thermal simulation tool for microsystem elements and MCMs
Szekely,V. ; Csendes,A. ; Rencz,M.
Pub. info.: Microlithography and Metrology in Micromachining II.  pp.64-75,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2880
10.

Conference Proceedings
Conference Proceedings
10. Engineering tool set for monolithic and hybrid microsystem design
Boutamine,H. ; Karam,J.M. ; Courtois,B. ; Drake,P. ; Oudinot,J. ; El Tahawi,H. ; Cao,A. ; Rencz,M. ; Poppe,A. ; Szekely,V.
Pub. info.: Microlithography and Metrology in Micromachining III.  pp.76-84,  1997.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3225