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29 results

Conference Proceedings

1. Preparation of Pressure Sensors by Semiconductor Wafer Direct Bonding

Merveille, C. ; Reiche, M. ; Brouwer, T.G.M.

Pub. info.:	Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications. pp.163-170, 1997. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	97-36

Conference Proceedings

2. INTERFACIAL STRUCTURE OF BONDED SILICON WAFERS

Reiche, M. ; Goesele, U. ; Tong, Q.-Y.

Pub. info.:	Proceedings of the Seventh International Symposium on Silicon Materials Science and Technology. pp.408-419, 1994. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	1994-10

Conference Proceedings

3. Bonding Behavior of Different Interfacial Layers

Reiche, M. ; Wiegand, M. ; Stolze, D. ; Schwarz, U.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.100-109, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-35

Conference Proceedings

4. Low Temperature Si-Si and GaAs-Si Direct Wafer Bonding using Spin-On Glass Intermediate Layer

Dragoi, V. ; Alexe, M. ; Reiche, M.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.80-84, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-35

Conference Proceedings

5. Effect of O 2 Plasma Pretreatment on the Bonding Behavior of Silicon (100) Wafers

Wiegand, M. ; Kraeuter, G. ; Reiche, M.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.282-291, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-35

Conference Proceedings

6. Preparation of Bonded Wafer Pairs

Reiche, M. ; Priewasser, K.H. ; Wittenzellner, E. ; Nauert, P. ; Nadrag, W.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.200-208, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-35

Conference Proceedings

7. Plasma Activation for Low-Temperature Wafer Direct Bonding

Reiche, M. ; Wiegand, M. ; Dragoi, V.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.292-301, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-35

Conference Proceedings

8. THE INFLUENCE OF STRESSES ON THE SURFACE-NEAR DEFECT STRUCTURE

Reiche, M. ; Nitzsche, W.

Pub. info.:	Defect engineering in semiconductor growth, processing and device technology : symposium held April 26-May 1, 1992, San Francisco, California, U.S.A.. pp.621-628, 1992. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	262

Conference Proceedings

9. Characterisation of Directly Bonded Silicon Wafers by Means of the Double Cantilever Crack Opening Method

Bagdahn, J. ; Petzold, M. ; Reiche, M. ; Gutjahr, K.

Pub. info.:	Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications. pp.291-298, 1997. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	97-36

10.

Conference Proceedings

10. The Effect of a Plasma Pretreatment on the Si/Si Bonding Behaviour

Reiche, M. ; Gutjahr, K. ; Stolze, D. ; Burczyk, D. ; Petzold, M.

Pub. info.:	Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications. pp.437-444, 1997. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	97-36

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