1.

Conference Proceedings
Conference Proceedings
1. Reliability of Copper Metallization for CMOS ULSI Technologies
Rathore, H.S. ; Nguyen, D.B. ; Agarwala, B. ; Wachnik, R.A. ; Procter, R.W.
Pub. info.: Interconnect and contact metallization for ULSI : proceedings of the international symposium.  pp.190-197,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-31
2.

Conference Proceedings
Conference Proceedings
2. Reliability Evaluation of Low-k Dielectrics for Sub-Micron Interconnection Application
Nguyen, D.B. ; Mcgahay, V. ; Endicott, G. ; Aggarwala, B. ; Rathore, H.S. ; Yankke, S.
Pub. info.: Proceedings of the Second International Symposium on Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues.  pp.112-125,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-8
3.

Conference Proceedings
Conference Proceedings
3. Low Electric Field Time-Dependent Dielectric Breakdown for BEOL Capacitor Application
Nguyen, D.B. ; Wachnik, R.A. ; Rathore, H.S. ; Kane, T.
Pub. info.: Proceedings of the Symposium on Reliability of Metals in Electronics.  pp.16-22,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-3
4.

Conference Proceedings
Conference Proceedings
4. Electromigration Behavior of Cu Interconnects in Oxide Dielectrics
Agarwala, B.N. ; Rathore, H.S.
Pub. info.: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium.  pp.120-133,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-27
5.

Conference Proceedings
Conference Proceedings
5. Electromigration in Two-Level Cu Interconnections with a Low Dielectric Constant Inter-Level Insulator
Hu, C-K. ; Gignac, L. ; Liniger, F. ; Rosenberg, R. ; Agarwala, B. ; Rathore, H.S. ; Chen, X.
Pub. info.: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium.  pp.112-119,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-27