1.

Conference Proceedings
Conference Proceedings
1. The Impact of Interface Charge on the Breakdown Voltage of Terminated 4H-SiC Power Devices
H. Matsushima ; H. Okino ; K. Mochizuki ; R. Yamada
Pub. info.: Silicon Carbide and Related Materials 2014 : Selected peer reviewed papers from the European Conference on Silicon Carbide & Related Materials (ECSCRM 2014), September 21-25, 2014, Grenoble, France.  pp.652-655,  2015.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 821-823
2.

Conference Proceedings
Conference Proceedings
2. 6.5 kV n-Channel 4H-SiC IGBT with Low Switching Loss Achieved by Extremely Thin Drift Layer
N. Watanabe ; H. Yoshimoto ; A. Shima ; R. Yamada ; Y. Shimamoto
Pub. info.: Silicon Carbide and Related Materials 2015 : [ICSCRM 2015] : selected, peer reviewed papers from the 16th International Conference on Silicon Carbide and Related Materials, October 4-9, 2015, Giardini Naxos, Italy.  pp.939-944,  2016.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 858
3.

Conference Proceedings
Conference Proceedings
3. Further Study on the Effect of Environment on Fatigue Crack Growth Behavior of 2000 and 7000 Series Aluminum Alloys
R. Yamada ; G. Itoh ; A. Kurumada ; M. Nakai
Pub. info.: THERMEC 2016 : selected peer reviewed papers from the 9th International Conference on Processing & Manufacturing of Advanced Materials, May 29 - June 03, 2016, Graz, Austria.  pp.2153-2157,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 879
4.

Conference Proceedings
Conference Proceedings
4. Characterization of Pinhole in Patterned Oxide Buried in Bonded Silicon-on-Insulator Wafers by Near-Infrared Scattering Topography and Microscopy
X. Wu ; J. Uchikoshi ; T. Hirokane ; R. Yamada ; K. Arima
Pub. info.: Analytical and diagnostic techniques for semiconductor materials, devices and processes 7.  pp.173-182,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 11(3)
5.

Conference Proceedings
Conference Proceedings
5. A Highly Efficient 3.3-kV SiC-Si Hybrid Power Module with a Novel SiC JBS Diode and a Si Advanced Trench HiGT
R. Yamada ; N. Kameshiro ; Y. Toyota ; T. Hirao ; K. Yasui
Pub. info.: Silicon Carbide and Related Materials 2015 : [ICSCRM 2015] : selected, peer reviewed papers from the 16th International Conference on Silicon Carbide and Related Materials, October 4-9, 2015, Giardini Naxos, Italy.  pp.1091-1094,  2016.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 858
6.

Conference Proceedings
Conference Proceedings
6. Effect of the Interfacial Thermal Resistance on Effective Thermal Conductivity of Al/SiC Particle-Dispersed Composites
K. Sugio ; R. Yamada ; Y.B. Choi ; G. Sasaki
Pub. info.: THERMEC 2016 : selected peer reviewed papers from the 9th International Conference on Processing & Manufacturing of Advanced Materials, May 29 - June 03, 2016, Graz, Austria.  pp.1889-1894,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 879
7.

Conference Proceedings
Conference Proceedings
7. Further Study on the Effect of Environment on Fatigue Crack Growth Behavior of 2000 and 7000 Series Aluminum Alloys
R. Yamada ; G. Itoh ; A. Kurumada ; M. Nakai
Pub. info.: THERMEC 2016.  pp.2153-2157,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 879
8.

Conference Proceedings
Conference Proceedings
8. Effect of the Interfacial Thermal Resistance on Effective Thermal Conductivity of Al/SiC Particle-Dispersed Composites
K. Sugio ; R. Yamada ; Y.B. Choi ; G. Sasaki
Pub. info.: THERMEC 2016.  pp.1889-1894,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 879