1.

Conference Proceedings
Conference Proceedings
1. Critical procedure for OPC software benchmarking with maskshop consideration
Barberet,A. ; Galan,G. ; Fanget,G.L. ; Richoilley,J.-C. ; Tissier,M. ; Quere,Y.
Pub. info.: Lithography for semiconductor manufacturing II : 30 May-1 June, 2001, Edinburgh, UK.  pp.188-199,  2001.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4404
2.

Conference Proceedings
Conference Proceedings
2. Inorganic bottom ARC SiOxNy for interconnection levels on 0.18-ｦﾌm technology
Trouiller,Y. ; Buffet,N. ; Mourier,T. ; Gobil,Y. ; Schiavone,P. ; Quere,Y.
Pub. info.: Advances in resist technology and processing XV : 23-25 February 1998, Santa Clara, California.  Part 1  pp.324-333,  1998.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3333
3.

Conference Proceedings
Conference Proceedings
3. 0.18-ｦﾌm optical lithography performances using an alternating DUV phase-shift mask
Trouiller,Y. ; Buffet,N. ; Mourier,T. ; Schiavone,P. ; Quere,Y.
Pub. info.: Optical microlithography XI : 25-27 February 1998, Santa Clara, California.  pp.25-35,  1998.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3334
4.

Conference Proceedings
Conference Proceedings
4. Mask manufacturing contribution on 248-nm and 193-nm lithography performances
Barberet,A. ; Fanget,G.L. ; Richoilley,J.-C. ; Tissier,M. ; Quere,Y.
Pub. info.: 17th European Conference on Mask Technology for Integrated Circuits and Microcomponents.  pp.90-98,  2000.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4349
5.

Conference Proceedings
Conference Proceedings
5. Anisotropy:A Valuable Ally in the Study of Point Defect Clustering
Weinberg,C. ; Quere,Y.
Pub. info.: Vacancies and interstitials in metals and alloys : Proceedings of the International Conference on Vacancies and Interstitials in Metals and Alloys held in Berlin, Germany, September 14-19, 1986.  Pt.3  pp.943-948,  1987.  Aederlmannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 15-18
6.

Conference Proceedings
Conference Proceedings
6. 193-nm scanner characterization by SEM and electrical CD measurements
Pain,L. ; Trouiller,Y. ; Barberet,A. ; Guirimand,O. ; Fanget,G.L. ; Martin,N. ; Quere,Y. ; Nier,M.E. ; Lajoinie,E. ; Louis,D. ; Heitzmann,M. ; Scheiblin,P. ; Toffoli,A.
Pub. info.: Metrology, inspection, and process control for microlithography XIV : 28 February - 2 March 2000, San Clara, California.  pp.96-107,  2000.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3998
7.

Conference Proceedings
Conference Proceedings
7. Mask manufacturing contribution on 248-nm and 193-nm lithography performances
Barberet,A. ; Fanget,G.L. ; Richoilley,J.-C. ; Tissier,M. ; Quere,Y.
Pub. info.: 20th Annual BACUS Symposium on Photomask Technology.  pp.902-910,  2000.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4186
8.

Conference Proceedings
Conference Proceedings
8. Lithographic CD variation in contact,via,local interconnect,and damascene levels
Trouiller,Y. ; Didiergeorges,A. ; Fanget,G.L. ; Laviron,C. ; Comboroure,C. ; Quere,Y.
Pub. info.: Multilevel Interconnect Technology III.  pp.116-127,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3883
9.

Conference Proceedings
Conference Proceedings
9. Inorganic bottom ARC SiOxNy for interconnection levels on 0.18-ｦﾌm technology
Trouiller,Y. ; Buffet,N. ; Mourier,T. ; Gobil,Y. ; Schiavone,P. ; Quere,Y.
Pub. info.: Multilevel Interconnect Technology II.  pp.122-131,  1998.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3508