1.

Conference Proceedings
Conference Proceedings
1. Recent Bonded SOI Wafer Thinning Results with Etch Rate Feedback
Neuner, J.W. ; Walsh, J.H. ; Mathur, D.P. ; Poultney, S.K.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.559-567,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. Recent Bonded SOI Wafer Thinning Results with a New Shape Pace Electrode
Neuner, J.W. ; Robbins, M.D. ; Mathur, D.P. ; Poultney, S.K.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.334-339,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36