Post-Cure Die Attach Delamination
- Author(s):
- Pare,Patrice ( IBM Canada Ltd. )
- Ray,Michel
- Publication title:
- 1996 International Symposium on Microelectronics : 8-10 October 1996, Minneapolis Convention Center, Minneapolis, Minnesota
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 2920
- Pub. Year:
- 1996
- Page(from):
- 162
- Page(to):
- 167
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780930815486 [0930815483]
- Language:
- English
- Call no.:
- P63600/2920
- Type:
- Conference Proceedings
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