1.

Conference Proceedings
Conference Proceedings
1. An Investigation of the Effects of Wafer Curvature Changes During Copper Damascene Processing
Carpio, R.A. ; Dorris, S.-T.L. ; Woodring, J. ; Owen, D.M. ; Abisia, D.
Pub. info.: Electrochemical processes in ULSI and MEMS : proceedings of the international symposium.  pp.235-250,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2004-17
2.

Conference Proceedings
Conference Proceedings
2. A new optical technique for monitoring wafer curvature and stress during copper damascene processing
Boye, C.A. ; Carpio, R. ; Woodring, J. ; Owen, D.M.
Pub. info.: Metrology, Inspection, and Process Control for Microlithography XVIII.  pp.328-336,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5375