1.

Conference Proceedings
Conference Proceedings
1. PARTICLE AND METALLIC IMPURITIES REMOVAL BY USING NEW SPIN CLEANER BASED ON UCT CLEANING CONCEPT
Kwada, K. ; Nakamori, M. ; Morita, H. ; Okano, S. ; Nitta, T. ; Ohmi, T.
Pub. info.: Proceedings of the Fifth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing.  pp.528-535,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-35
2.

Conference Proceedings
Conference Proceedings
2. Eliminating Metal-Sputter Contamination in Ion Implanter for Low Reverse-Bias Current. 450C-Annealed Junctions
Tomita, K. ; Migita, T. ; Shimonishi, S. ; Shibata, T. ; Ohmi, T. ; Nitta, T.
Pub. info.: Proceedings of the Symposium on the Degradation of Electronic Devices due to Device Operation as well as Crystalline and Process-Induced Defects.  pp.286-297,  1994.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1994-1
3.

Conference Proceedings
Conference Proceedings
3. A Group Contribution Molecular Model for Liquids and Solutions Composed of the Groups CH3, CH2, OH, and CO
Nitta, T. ; Turek, E. A. ; Greenkorn, R. K. ; Chao, K. C.
Pub. info.: Phase equilibria and fluid properties in the chemical industry : estimation and correlation : a symposium.  pp.421-,  1977.  Washington, D.C..  American Chemical Society
Title of ser.: ACS symposium series
Ser. no.: 60