1.

Conference Proceedings
Conference Proceedings
1. CMP Compatibility of Partially Cured Benzocyclobutene (BCB) for a Via-First 3D IC Process
McMahon, J.J. ; Niklaus, F. ; Kumar, R.J. ; Yu, J. ; Lu, J.-Q. ; Gutmann, R.J.
Pub. info.: Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A..  pp.63-68,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 867
2.

Conference Proceedings
Conference Proceedings
2. Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding.
Niklaus, F. ; Kumar, R.J. ; McMahon, J.J. ; Yu, J. ; Matthias, T. ; Wimplinger, M. ; Lindner, P. ; Lu, J.-Q. ; Cale, T.S. ; Gutmann, R.J.
Pub. info.: Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A..  pp.393-398,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 863
3.

Technical Paper
Technical Paper
3. 3D Printing of Silicon Micro and Nano Structures by Ion Implantation, Silicon Deposition, and Selective Silicon Etching.
Fischer, A.C. ; Niklaus, F.
Pub. info.: S.M.E. technical paper.  2013.  Dearborn, Mich..  Society of Manufacturing Engineers
Title of ser.: SME Technical Paper : TP
Ser. no.: 2013
4.

Conference Proceedings
Conference Proceedings
4. Characterization of transfer-bonded silicon bolometer arrays
Niklaus, F. ; Pejnefors, J. ; Dainese, M. ; Haggblad, M. ; Hellstrom, P.-E. ; Wallgren, U.J. ; Stemme, G.
Pub. info.: Infrared Technology and Applications XXX.  pp.521-530,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5406