1.

Conference Proceedings
Conference Proceedings
1. IMP copper seed layer formation with TaN barrier for deep submicron
Narayanan,B. ; Li,C.Y. ; Lee,K. ; Yu,B. ; Wu,J.J. ; Foo,P.D. ; Xie,J.
Pub. info.: Multilevel Interconnect Technology III.  pp.42-45,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3883
2.

Conference Proceedings
Conference Proceedings
2. Influence of IMP copper flash layer on the properties of copper films deposited by metal organic chemical vapor deposition
Li,C.Y. ; Zhang,D.H. ; Qian,Y. ; Narayanan,B. ; Wu,J.J. ; Yu,B. ; Jiang,Z.X. ; Foo,P.D. ; Xie,J. ; Zhang,Q. ; Yoon,S.F.
Pub. info.: Multilevel Interconnect Technology III.  pp.46-49,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3883