Flip Chip Bonding Technology for Molded Interconnect Device
- Author(s):
Yagi, Yoshihiko ( Matsushita Electric Industrial Col., Ltd. ) Yoshino, Michiro Nakamura, Kojiro Nishida, Kazuto Kakino, Manabu Hirose, Takayuki Harazono, Fumikazu ( Panasonic System Solutions Company ) - Publication title:
- Proceedings, 2003 International Symposium on Microelectronics, November 18-20, 2003, Hynes Convention Center, Boston, Massa Massachusetts, USA
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5288
- Pub. Year:
- 2003
- Page(from):
- 256
- Page(to):
- 261
- Pages:
- 6
- Pub. info.:
- Reston, Va.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819451897 [0819451894]
- Language:
- English
- Call no.:
- P63600/5288
- Type:
- Conference Proceedings
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