1.

Conference Proceedings
Conference Proceedings
1. The Smart-Cut Process: Status and Developments
Aspar, B. ; Lagahe, C. ; Moriceau, H. ; Jalaguier, E. ; Mas, A. ; Rayssac, O. ; Biasse, Soubie; B. ; Bruel, M. ; Auberton-Hevre, A.J. ; Barge, T. ; Letertre, F. ; Maleville, C.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.48-59,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
2.

Conference Proceedings
Conference Proceedings
2. Influence of the annealing duration on the interface roughness and electrical properties of low-dose SIMOX wafers
Munteanu, D. ; Guilhalmenc, C. ; Cristoloveanu, S. ; Moriceau, H. ; Cartier, A.M. ; Aspar, B.
Pub. info.: Proceedings of the Eighth International Symposium on Silicon-on-Insulator Technology and Devices.  pp.131-136,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-23
3.

Conference Proceedings
Conference Proceedings
3. Unibond SOI wafers achieved by Smart-Cut process
Bruel, M. ; Aspar, B. ; Maleville, C. ; Moriceau, H. ; Auberton-Herve, A.J. ; Barge, T.
Pub. info.: Proceedings of the Eighth International Symposium on Silicon-on-Insulator Technology and Devices.  pp.3-14,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-23
4.

Conference Proceedings
Conference Proceedings
4. Unibond SOI Wafers Achieved by Smart-Cut Process
Bruel, M. ; Aspar, B. ; Maleville, C. ; Moriceau, H. ; Auberton-Herve, A.J. ; Barge, T.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.13-24,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
5.

Conference Proceedings
Conference Proceedings
5. Detailed Characterization of Wafer Bonding Mechanisms
Maleville, C. ; Rayssac, O. ; Moriceau, H. ; Blasse, B. ; Baroux, L. ; Aspar, B. ; Bruel, M.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.46-55,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
6.

Conference Proceedings
Conference Proceedings
6. Strained Silicon on Insulator Wafers Made by the Smart CutTM Technology
Ghyselen, B. ; Bogumilowicz, Y. ; Aulnette, C. ; Abbadie, A. ; Osternaud, B. ; Besson, P. ; Daval, N. ; Andrieu, F. ; Cayrefourq, I. ; Moriceau, H. ; Ernst, T. ; Tiberj, A. ; Rayssac, O. ; Blondeau, B. ; Mazure, C. ; Lagahe-Blanchard, C. ; Pocas, S. ; Cartier, A.-M. ; Hartmann, J.-M. ; Leduc, P. ; Nardo, C.Di ; Lugand, J.-F. ; Fournel, F. ; Semeria, M.-N. ; Kernevez, N. ; Campidelli, Y. ; Kermarrec, O. ; Morand, Y. ; Rivoire, M. ; Bensahel, D. ; Paillard, V. ; Vincent, L. ; Claverie, A. ; Boucaud, P.
Pub. info.: High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.83-88,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 809
7.

Conference Proceedings
Conference Proceedings
7. The Bonding Energy Control: An Original Way to Debondable Substrates
Moriceau, H. ; Rayssac, O. ; Aspar, B. ; Ghyselen, B.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.49-56,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
8.

Conference Proceedings
Conference Proceedings
8. IN-SITU PREPARATION OF Y-Ba-Cu-O THIN FILMS USING MASS-SPECTROMETER RATE CONTROL AND ATOMIC OXYGEN
Ohlsen, H. ; Ottosson, M. ; Hudner, J. ; Ostling, M. ; Stolt, L. ; Nordblad, P. ; Villegier, J.-C. ; Moriceau, H. ; Weiss, F. ; Thomas, O.
Pub. info.: Layered superconductors : fabrication, properties, and applications : symposium held April 27-May 1, 1992, in San Francisco, California, U.S.A..  pp.299-304,  1992.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 275
9.

Conference Proceedings
Conference Proceedings
9. ALD alumina films as buried dielectric layers for SOI structures
de Beaumont, C. ; Moriceau, H. ; Rayssac, O. ; Bresson, N. ; Cristoloveanu, S. ; Charvet, A.M.
Pub. info.: Silicon-on-insulator technology and devices XII : proceedings of the international symposium.  pp.231-236,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-03
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Conference Proceedings
Conference Proceedings
10. New SOI devices transferred onto fused silica by direct wafer bonding
Lagahe-Blanchard, C. ; Aspar, B. ; Paillet, P. ; Ferlet-Cavois, V. ; Fel, N. ; Pavageau, C. ; du Port de Poncharra, J. ; Moriceau, H.
Pub. info.: Silicon-on-insulator technology and devices XII : proceedings of the international symposium.  pp.237-242,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-03