1.

Conference Proceedings
Conference Proceedings
1. Application of Polyimides in Thin Film Packaging (MCM DIC) at IBM;
McHerron, D.
Pub. info.: Proceedings from the ninth Meeting of the Symposium on Polymers for Microelectronics at Winterthur, May 1st, 2nd, & 3rd, 2000.  pp.1-26,  2000.  [S.l.].  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-37
2.

Conference Proceedings
Conference Proceedings
2. Evaluation of Cu Capping Alternatives for Polyimide-Cu MCM-D;
McHerron, D.
Pub. info.: Proceedings from the tenth Meeting of the Symposium on Polymers for Microelectronics [May 8th, 9th, & 10th, 2002].  pp.91-104,  2002.  [S.l.].  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-16
3.

Conference Proceedings
Conference Proceedings
3. BEOL lithography for early development at the 65-nm node
DellaGuardia, R. ; Kwong, R.W. ; Li, W. ; Lawson, P. ; Burkhardt, M. ; Grauer, I.C. ; Wu, Q. ; Angyal, M. ; Hichri, H. ; Melville, I. ; Kumar, K. ; Lin, Y. ; Holmes, S.J. ; Varanasi, R. ; Spooner, T. ; McHerron, D.
Pub. info.: Optical Microlithography XVII.  pp.980-987,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5377