1.

Conference Proceedings
Conference Proceedings
1. Fusion-Bonded Multilayered SOI for MEMS Applications
Somasundram, K. ; McCann, P. ; Cole, D. ; McNamara, C. ; Boyle, A. ; Devine, C. ; Brown, A. ; Nevin, A.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.288-300,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. Characteristics and Applications of Silicon Direct Bonded Interfaces
McCann, P. ; Devine, C. ; Ruddell, F. ; Baine, P. ; Gamble, H.S. ; Nevin, W.A.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.154-165,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
3.

Conference Proceedings
Conference Proceedings
3. Back-end analysis of SOT substrates incorporating metallic layers using a novel non-destructive picosecond ultrasonic technique
Rain, M.F. ; McCusker, N.D. ; McCann, P. ; Nevin, W.A. ; Gamble, H.S.
Pub. info.: Silicon-on-insulator technology and devices XI : proceedings of the international symposium.  pp.63-68,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-5
4.

Conference Proceedings
Conference Proceedings
4. Factors Affecting Stress-Induced Defect Generation in Trenched SOI for High-Voltage Applications
Nevin, W.A. ; Somasundram, K. ; McCann, P. ; Cao, X. ; Byrne, S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.232-241,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
5.

Conference Proceedings
Conference Proceedings
5. An Investigation into Interfacial Oxide in Direct Silicon Bonding
McCann, P. ; Byrne, S. ; Nevin, A.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.106-113,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
6.

Conference Proceedings
Conference Proceedings
6. Electrical and Structural Characterization of Silicon on Silicon Bonded Interfaces
McCann, P. ; MeKeever, J. ; Nicholson, D. ; Ruddell, F. ; Gamble, H.S. ; Nevin, W.A.
Pub. info.: High purity silicon VII : proceedings of the international symposium.  pp.369-376,  2002.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-20
7.

Conference Proceedings
Conference Proceedings
7. Fusion-bonded multilayer SOI for MEMS applications
Somasundram, K. ; Cole, D. ; McNamara, C. ; Boyle, A. ; McCann, P. ; Devine, C. ; Nevin, A.
Pub. info.: Smart Sensors, Actuators, and MEMS.  1  pp.12-19,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5116
8.

Conference Proceedings
Conference Proceedings
8. Fusion-bonded mutilayered SOI for MEMS applications
Cole, D. ; McNamara, C. ; Somasundram, K. ; Boyle, A. ; Devine, C. ; MoKeever, J. ; McCann, P. ; Nevin, A.
Pub. info.: Opto-Ireland 2002: Optics and Photonics Technologies and Applications.  Part Two  pp.623-632,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4876