1.

Conference Proceedings
Conference Proceedings
1. 450 mm Silicon Wafers Challenges - Wafer Thickness Scaling
M. Goldstein ; M. Watanabe
Pub. info.: High Purity Silicon 10.  pp.3-13,  2008.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(6)
2.

Conference Proceedings
Conference Proceedings
2. Study of Inhibition Characteristics of Slurry Additives in Copper CMP Using Force Spectroscopy
M. K. Keswani ; H. Lee ; S. Babu ; U. Patri ; Y. Hong ; L. Economikos ; M. Goldstein ; L. Borucki ; A. Philipossian ; Y. Zhuang
Pub. info.: Silicon materials science and technology X.  pp.515-522,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 2(2)
3.

Technical Paper
Technical Paper
3. A Hybrid RANS/LES Approach for Predicting Jet Noise
M. Goldstein
Pub. info.: AIAA meeting papers on disc.  2006.  Reston, Va..  American Institute of Aeronautics and Astronautics
Title of ser.: AIAA Paper : AIAA/CEAS Aeroacoustics Conference
Ser. no.: 2006
4.

Conference Proceedings
Conference Proceedings
4. Uniaxial crystal last optical element for second- and third-generation immersion lithography
G. Y. Sirat ; M. Goldstein
Pub. info.: Optical Microlithography XXI.  2  pp.69242T-1-69242T-10,  2008.  Bellingham, Wash..  Society of Photo-optical Instrumentation Engineers
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6924
5.

Conference Proceedings
Conference Proceedings
5. Low-cost EUV collector development: design, process, and fabrication
R. D. Venables ; M. Goldstein ; D. Engelhaupt ; S. H. Lee ; E. M. Panning
Pub. info.: Emerging lithographic technologies XI.  2007.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6517