1.

Conference Proceedings
Conference Proceedings
1. Direct Bonding of Thick Film Polysilicon to Glass Substrates
Luoto, H. ; Suni, T. ; Henttinen, K. ; Kulawski, M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.194-204,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
2.

Conference Proceedings
Conference Proceedings
2. SOI Wafers with Buried Cavities
Suni, T. ; Henttinen, K. ; Dekker, J. ; Luoto, H. ; Kulawski, M. ; Makinen, J. ; Mutikainen, R.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.216-225,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
3.

Conference Proceedings
Conference Proceedings
3. Wafer Scale Packaging of MEMS by Using Plasma Activated Wafer Bonding
Suni, T. ; Henttinen, K. ; Lipsainen, A. ; Dekker, J. ; Luoto, H. ; Kulawski, M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.173-183,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02