1.

Conference Proceedings
Conference Proceedings
1. High Electric Field Breakdown of 4H-SiC p-n Junction Diodes
Tin, C. C. ; Madangarli, V. ; Hu, R. ; Luckowski, E. ; Casady, J. ; Isaacs-Smith, T. ; Gradinaru, G. ; Sudarshan, T. S. ; Johnson, R. W.
Pub. info.: III-Nitride, SiC, and Diamond Materials for Electronic Devices : symposium held April, 1996, San Francisco, California, U.S.A..  pp.111-,  1996.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 423
2.

Conference Proceedings
Conference Proceedings
2. Fermi Level Pinning and Schottky Barrier Characteristics on Reactively Ion Etched 4H-SiC
Skromme, B. J. ; Luckowski, E. ; Moore, K. ; Clemens, S. ; Resnick, D. ; Gehoski, T. ; Ganser, D.
Pub. info.: Silicon carbide and related materials - 1999 : ICSCRM'99, proceedings of the International Conference on Silicon Carbide and Related Materials - 1999, Research Triangle Park, North Carolina, USA, October 10-15, 1999.  pp.1029-1032,  2000.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 338-342(2)
3.

Conference Proceedings
Conference Proceedings
3. Integration of UTR processes into MPU IC manufacturing flows
Cobb, J.L. ; Dakshina-Murthy, S. ; Parker, C. ; Luckowski, E. ; Martinez, A.M. ; Peters, R.D. ; Wu, W. ; Hector, S.D.
Pub. info.: Advances in Resist Technology and Processing XIX.  Part One  pp.277-286,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4690
4.

Conference Proceedings
Conference Proceedings
4. Single-layer and bilayer resist processes for EUV-type integrations
Peters, R.D. ; Parker, C. ; Cobb, J. ; Luckowski, E. ; Weisbrod, E. ; Dauksher, B.
Pub. info.: Advances in Resist Technology and Processing XXI.  pp.746-756,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5376
5.

Conference Proceedings
Conference Proceedings
5. Fabrication of integrated circuits with high yield using ultra-thin resist processes
Peters, R.D. ; Postnikov, S.V. ; Cobb, J.L. ; Dakshina-Murthy, S. ; Stephens, T. ; Parker, C. ; Luckowski, E. ; Martinez, A.M. Jr., ; Wu, W. ; Hector, S.D.
Pub. info.: Advances in Resist Technology and Processing XX.  2  pp.1390-1401,  2003.  Bellingham, CA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5039