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15 results

Conference Proceedings

1. Transient Thermal and Mechanical Modeling of 3D-IC Structures

Zhang, I. ; Lu, J.-Q. ; Gutmann, R.I. ; Cale, T.S.

Pub. info.:	Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. pp.370-404, 2003. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-13

Conference Proceedings

2. 3D System-on-a-Chip Using Dielectric Glue Bonding and Cu Damascene Inter-Wafer Interconnects

Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K-W. ; Craft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraum, E. ; Cale, T.S. ; Gutmann, R.J.

Pub. info.:	Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. pp.381-389, 2003. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-13

Conference Proceedings

3. Dielectric Glue Wafer Bonding and Bonded Wafer Thinning for Wafer-Level 3D Integration

Lu, J.-Q. ; Kwon, Y. ; Jindal, A. ; McMahon, J.J. ; Cale, T.S. ; Gutmann, R.J.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.76-86, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

Conference Proceedings

4. The Role of the Si-SiO2 (CVD) Interface in Degradation Effects for High-Speed Bipolar Transistors

Lu, J.-Q. ; Schottl, S. ; Stefanov, E. ; Koch, F. ; Mahnkopf, R. ; Klose, H.

Pub. info.:	Defect and impurity engineered semiconductors and devices : symposium held April 17-21, 1995, San Francisco, California, U.S.A.. pp.743-, 1995. Pittsburgh, PA. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	378

Conference Proceedings

5. Low-Temperature Silicon Wafer Bonding with Titanium

Yu, J. ; Wang, Y.M. ; Lu, J.-Q. ; Gutmann, R.J.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.311-318, 2005. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2005-02

Conference Proceedings

6. CMP Compatibility of Partially Cured Benzocyclobutene (BCB) for a Via-First 3D IC Process

McMahon, J.J. ; Niklaus, F. ; Kumar, R.J. ; Yu, J. ; Lu, J.-Q. ; Gutmann, R.J.

Pub. info.:	Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.. pp.63-68, 2005. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	867

Conference Proceedings

7. Wafer-Level 3D System-on-a-Chip using Dielectric Glue Wafer Bonding and Cu Damascene Inter-Wafer Interconnects

Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K.-W. ; Kraft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraun, E. ; Cale, T.S. ; Gutmann, R.J

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.87-95, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

Conference Proceedings

8. Wafer Bonding Using Low-k Dielectrics aa Bonding Glue in Three-Dimensional Integration

Kwon, Y. ; Lu, J.-Q. ; Gutmann, R.J. ; Kraft, R.P. ; McDonald, J. ; Cale, T.S.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.145-154, 2001. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2001-27

Conference Proceedings

9. Wafer Bonding Using Dielectric Polymer Thin Films in 3D Integration

Kwon, Y. ; Lu, J.-Q. ; Kraft, R.P. ; McDonald, J.F. ; Gutmann, R.J. ; Cale, T.S.

Pub. info.:	Polymer interfaces and thin films : symposium held November 26-30, 2001, Boston, Massachusetts, U.S.A.. pp.231-238, 2002. Warrendale, PA. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	710

10.

Conference Proceedings

10. Planarization Issues in Wafer-Level Three-Dimensional (3D) Integration

Lu, J.-Q. ; Rajagopalan, G. ; Gupta, M. ; Cale, T.S. ; Gutmann, R.J.

Pub. info.:	Advances in chemical-mechanical polishing : symposium held April 13-15, 2004, San Francisco, California, U.S.A.. pp.217-230, 2004. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	816

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Author: Lu, J.-Q.