1.

Conference Proceedings
Conference Proceedings
1. Evaluation of Embedded Power Technology For IPEM Packaging Applications
Liang, Zhenxian ; Lee, Fred C. ; van Wyk, J.D. ; Lu, G-Q.
Pub. info.: Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001.  pp.394-398,  2001.  Washington, DC.  IMAPS
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4587
2.

Technical Paper
Technical Paper
2. Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices.
Lu, G-Q. ; Liu, X. ; Wen, S. ; Calata, J. N. ; Bai, J. G.
Pub. info.: A.S.M.E. paper.  2003.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : IMECE
Ser. no.: 2003