Riesz, Ferenc ; Lischka,K. ; Rakennus, K. ; Hakkarainen, T. ; Pesek, A. ; Koppensteiner, E.
Pub. info.:
Structure and properties of interfaces in materials : symposium held Decmber[i.e. December] 2-5, 1991, Boston, Massachusetts, U.S.A.. pp.23-28, 1992. Pittsburgh. Materials Research Society
Silicon carbide, III-nitrides and related materials, ICSCIII-N'97 : proceedings of the International Conference on Silicon Carbide, III-Nitrides and Related Materials, Stockholm, Sweden, September 1997. Part2 pp.1367-1370, 1998. Zuerich, Switzerland. Trans Tech Publications
Silicon carbide, III-nitrides and related materials, ICSCIII-N'97 : proceedings of the International Conference on Silicon Carbide, III-Nitrides and Related Materials, Stockholm, Sweden, September 1997. Part2 pp.1339-1342, 1998. Zuerich, Switzerland. Trans Tech Publications
Silicon carbide, III-nitrides and related materials, ICSCIII-N'97 : proceedings of the International Conference on Silicon Carbide, III-Nitrides and Related Materials, Stockholm, Sweden, September 1997. Part2 pp.1173-1176, 1998. Zuerich, Switzerland. Trans Tech Publications
Silicon carbide, III-nitrides and related materials, ICSCIII-N'97 : proceedings of the International Conference on Silicon Carbide, III-Nitrides and Related Materials, Stockholm, Sweden, September 1997. Part2 pp.1197-1200, 1998. Zuerich, Switzerland. Trans Tech Publications
Proceedings of the 18th International Conference on Defects in Semiconductors : ICDS-18, Sendai, Japan, July 23-28, 1995. pp.561-566, 1995. Zurich, Switzerland. Trans Tech Publications
II-VI compounds and semimagnetic semiconductors : joint proceedings of the Third European Workshop on II-VI Compounds, Linz, Austria, 26-28 September 1994, and the Fourth International Workshop on Semimagnetic (Diluted Magnetic) Semiconductors, Linz, Austria, 26-28 September 1994. pp.395-398, 1995. Aedermannsdorf, Switzerland. Trans Tech Publications
Proceedings of the 17th International Conference on Defects in Semiconductors : ICDS-17, Gmunden, Austria, July 18-23, 1993. Pt.1 pp.561-566, 1994. Zurich, Switzerland. Trans Tech Publications