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Conference Proceedings
Conference Proceedings
1. PREDICTION AND PREVENTION OF STRESS MIGRATION AND ELECTROMIGRATION DAMAGE IN PASSIVATED LINES
Borgesen, P. ; Korhonen, M. A., ; Li, C.-Y.
Pub. info.: Materials reliability in microelectronics II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A..  pp.27-32,  1992.  Pittsburgh, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 265
2.

Conference Proceedings
Conference Proceedings
2. Stress-Voiding and Electromigration Reliability of Interconnects in ULSI-Circuits
Korhonen, M.A. ; Li, C.-Y.
Pub. info.: Proceedings of the Symposium on Reliability of Metals in Electronics.  pp.69-80,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-3
3.

Conference Proceedings
Conference Proceedings
3. Effect of vanadium on light olefins selectivity
Li, C.-Y. ; Yan, S.-H. ; Qiu, Z.-H. ; Tang, L.-W. ; Gu, M.-Y.
Pub. info.: Fluid catalytic cracking V : materials and technological innovations.  pp.133-140,  2001.  Amsterdam.  Elsevier
Title of ser.: Studies in surface science and catalysis
Ser. no.: 134
4.

Conference Proceedings
Conference Proceedings
4. *A DAMAGE INTEGRAL APPROACH TO SOLDER JOINT FATIGUE
Li, C.-Y. ; Subrahmanyan, R. ; McGroarty, J.
Pub. info.: Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A..  pp.395-404,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 203
5.

Conference Proceedings
Conference Proceedings
5. Electromigration Failure Distributions for Multi-Layer Interconnects as a Function of Line Width: Experiments and Simulation
Brown, D. D. ; Sanchez, J. E., Jr. ; Pham, V. ; Besser, P. R. ; Korhonen, M. A. ; Li, C.-Y.
Pub. info.: Advanced metallization for future ULSI : symposium held April 8-11, 1996, San Francisco, California, U.S.A..  pp.107-,  1996.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 427
6.

Conference Proceedings
Conference Proceedings
6. Flip-Chip Metallurgies for Lead-Free Solders
Korhonen, T. M. ; Hong, S. J. ; Korhonen, M. A. ; Li, C.-Y.
Pub. info.: Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A..  pp.79-,  1998.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 515
7.

Conference Proceedings
Conference Proceedings
7. Under Bump Metallization Development for Eutectic Pb-Sn Solders
Hong, S. J. ; Korhonen, T. M. ; Korhonen, M. A. ; Li, C.-Y.
Pub. info.: Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A..  pp.73-,  1998.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 515
8.

Conference Proceedings
Conference Proceedings
8. The Effect of Cluster Interactions on Electromigration Induced Stress Evolution in Confined Metal Lines
Brown, D. D. ; Sanchez, J. E., Jr. ; Besser, P. R. ; Korhonen, M. A. ; Li, C.-Y.
Pub. info.: Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A..  pp.197-,  1995.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 391
9.

Conference Proceedings
Conference Proceedings
9. In situ multiplexing long-path fiber optic remote sensing system of methane with single laser source
Yin, W.-B. ; Zhao, J.-M. ; Li, C.-Y. ; Xiao, L.-T. ; Jia, S.-T.
Pub. info.: Advanced sensor systems and applications : 15-18 October 2002, SHanghai, China.  pp.240-246,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4920
10.

Conference Proceedings
Conference Proceedings
10. The optimization of H.264/AVC baseline decoder on low-cost TriMedia DSP processor
Wang, S.-W. ; Yang, Y.-T. ; Li, C.-Y. ; Tung, Y.-S. ; Wu, J.-L.
Pub. info.: Applications of digital image processing XXVII : 2-6 August 2004, Denver, Colorado, USA.  pp.524-535,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5558