1.

Conference Proceedings
Conference Proceedings
1. Effect of Indium on the Microstructures and Mechanical Properties of Dental Gold Alloys
Jung, H.Y. ; Lee, S.H. ; Doh, J.M. ; Yoon, J.K. ; Lim, H.N.
Pub. info.: Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China.  pp.738-741,  2006.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 510-511
2.

Conference Proceedings
Conference Proceedings
2. Modification of Natural Zeolite Powder and Its Application to Interior Non-Woven Textile for Indoor Air Quality Control
Lim, H.M. ; Jung, J.S. ; Kim, D.S. ; Lee, D.J. ; Lee, S.H. ; Kim, W.N.
Pub. info.: Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China.  pp.934-937,  2006.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 510-511
3.

Conference Proceedings
Conference Proceedings
3. CHARACTERIZATION OF FERROELECTRIC THIN FILM PLZT (9/65/35) ON R-PLANE SAPPHIRE
Krishnakumar, S. ; Esener, S.C. ; Fan, C. ; Ozguz, V.H. ; Title, M.A. ; Cozzdino, C. ; Lee, S.H.
Pub. info.: Ferroelectric thin films : symposium held April 16-20, 1990, San Francisco, California, U.S.A..  pp.91-96,  1990.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 200
4.

Conference Proceedings
Conference Proceedings
4. Effect of Tin on the Microstructures and Mechanical Properties ofa Au-Pt-Cu Alloy
Kim, M.H. ; Lee, S.H. ; Lim, H.N. ; Doh, J.M. ; Baik, H.G.
Pub. info.: Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China.  pp.278-281,  2006.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 510-511
5.

Conference Proceedings
Conference Proceedings
5. Effect of Indium on Bonding between Porcelain and Au-Pt-Cu Alloy
Lee, S.H. ; Jung, H.Y. ; Doh, J.M. ; Yoon, J.K. ; Lim, H.N.
Pub. info.: Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China.  pp.282-285,  2006.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 510-511
6.

Conference Proceedings
Conference Proceedings
6. Inter facial Reaction between Molten Al Alloys and Titanium Matrix Composites
Sung, S.Y. ; Choi, B.J. ; Lee, S.H.
Pub. info.: Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China.  pp.310-313,  2006.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 510-511
7.

Conference Proceedings
Conference Proceedings
7. High-Q rf passives on organic substrates using a low-cost low-temperature laminate process
Damia, S. ; Lee, S.H. ; Bhattacharya, S. ; Ayazi, F. ; Swaminathan, M.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France.  pp.660-669,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4755
8.

Conference Proceedings
Conference Proceedings
8. Laser-induced shock wave removal of chemical-mechanical polishing slurries from silicon wafers
Lee, J.M. ; Cho, S.H. ; Park, J.G. ; Lee, S.H. ; Han, Y.P. ; Kim, S.Y.
Pub. info.: Third International Symposium on Laser Precision Microfabrication : proceedings : 27-31 May, 2002, Osaka, Japan.  pp.287-289,  2003.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4830
9.

Conference Proceedings
Conference Proceedings
9. Why Debonding is Useful in SOI
Cha, G. ; Lee, S.H. ; Park, H.J. ; Lee, K.H. ; Kang, H.S. ; Song, C.S. ; Kim, D.J. ; Kim, Y.C. ; Kim, S.K.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.119-128,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
10.

Conference Proceedings
Conference Proceedings
10. Characterization of interfaces in silicon-on-insulator structure
Kang, S.G. ; Ryoo, K. ; Kim, H.R. ; Seo, G. ; Lee, S.H. ; Kim, D.S. ; Hong, P.Y
Pub. info.: ALTECH 95 : analytical techniques for semiconductor materials and process characterization II : proceedings of the Satellite Symposium to ESSDERC 95, The Hague, The Netherlands.  pp.203-216,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-30