1.

Conference Proceedings
Conference Proceedings
1. Present and Future Role of CMP in Wafer Bonding
Gui, C. ; Elwenspoek, M. ; Gardeniers, J.G.E. ; Lambeck, P.V.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.114-126,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. Silicon OxyNitride: A Versatile Material for Integrated Optics Application
Worhoff, K. ; Driessen, A. ; Lambeck, P.V.
Pub. info.: Silicon Nitride and Silicon Dioxide Thin Insulating Films : proceedings of the sixth International Symposium.  pp.191-205,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-7
3.

Conference Proceedings
Conference Proceedings
3. Planar Waveguide Devices on a Silicon Compatible Technology Platform
Worhoff, K. ; Lambeck, P.V. ; Klunder, D.J.W. ; de Ridder, R.M. ; Heidman, R.G. ; Roeloffzen, C.G.H. ; Hussein, G.M. ; Musa, S. ; van Weerden, H.J. ; Driessen, A.
Pub. info.: Integrated optoelectronics : proceedings of the first international symposium.  pp.279-312,  2002.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-4
4.

Conference Proceedings
Conference Proceedings
4. SiON technology for integrated optical sensors (Invited Paper)
Lambeck, P.V. ; Worhoff, K.
Pub. info.: Integrated Optical Devices: Fabrication and Testing.  pp.195-204,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4944