1.

Conference Proceedings
Conference Proceedings
1. APPLICATION OF 150 mm BONDED WAFER TECHNOLOGY TO A POWER ASIC PROCESS
G.V. Rouse ; D.F. Hemmenway ; L.G. Pearce ; J.J. Hackenberg ; P.A Begley ; G. Bajor
Pub. info.: Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications.  pp.283-292,  1993.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-29
2.

Conference Proceedings
Conference Proceedings
2. Single Event Effects and Total Dose Testing of the Intersil ISL70003SEH Integrated Point of Load Converter
N.W. van Vonno ; J.D. White ; L.G. Pearce
Pub. info.: Proceedings of 10th European Space Power Conference : 13-17 April 2014 Noordwijkerhout, the Netherlands.  2014.  Noordwijk.  ESA Communications
Title of ser.: ESA SP
Ser. no.: 719