1.

Conference Proceedings
Conference Proceedings
1. Texture Change during Grain Growth in Non-Oriented Electrical Steel
Y. Arita ; L. Chan ; S.D. Sintay ; A.D. Rollett
Pub. info.: Recrystallization and grain growth IV : selected peer reviewed papers from the Fourth International Conference on Recrystallization and Grain Growth (ReX & GG 2010), July 4-9, 2010, Sheffield, U.K..  pp.33-40,  2012.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 715-716
2.

Conference Proceedings
Conference Proceedings
2. Investigation of Effect of Germanium on the Crystallization Process of Hafnium Aluminum Oxide Matrix
F. Zheng ; W.K. Choi ; H.G. Chew ; L. Chan
Pub. info.: Nanocrystal Embedded Dielectrics for Electronic and Photonic Devices.  pp.11-17,  2008.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 11(17)
3.

Conference Proceedings
Conference Proceedings
3. Optimisation of Weld Overlay Cladding Parameters Using Full-Factorial Design of Experiment
L. Chan ; I. Shyha ; D. Dryer ; J. Hamilton
Pub. info.: 4th Asia Conference on Mechanical and Materials Engineering : selected, peer reviewed papers from the 4th Asia Conference on Mechanical and Materials Engineering, July 14-18, 2016, Kuala Lumpur, Malaysia.  pp.54-58,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 880
4.

Conference Proceedings
Conference Proceedings
4. Investigation of Aramid Fibers Compared with Steel Fiber on Bending Behavior of Hybrid RC Beams
L. Chan ; G. Tanapornraweekit ; S. Tangtermsirikul
Pub. info.: Composite Materials and Material Engineering : Selected, peer reviewed papers from the 2016 International Conference on Composite Materials and Material Engineering, March 9-11, 2016, Bangkok, Thailand.  pp.117-120,  2016.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 860
5.

Conference Proceedings
Conference Proceedings
5. Defect Engineering for Ultrashallow Junctions using Surfaces
B. G. Seebauer ; S. Yeong ; M. Srinivasan ; C. Kwok ; R. Vaidyanathan ; B. Colombeau ; L. Chan
Pub. info.: Advanced gate stack, source/drain and channel engineering for Si-based CMOS 3 : new materials, processes and equipment.  pp.365-372,  2007.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 6(1)
6.

Conference Proceedings
Conference Proceedings
6. Comparison of SiOxNy Thin Films Deposited by ECR-PECVD at 2.4 and 3.0 mTorr Total Pressure
J. Wojcik ; L. Chan ; W.N. Lennard ; J.A. Davies ; P. Mascher
Pub. info.: 45th annual technical conference proceedings, April 13-18, 2002, Lake Buena Vista, Florida.  pp.558-560,  2002.  Albuquerque, NM.  Society of Vacuum Coaters
Title of ser.: Annual Technical Conference of Society of Vacuum Coaters
Ser. no.: 45
7.

Conference Proceedings
Conference Proceedings
7. Optimisation of Weld Overlay Cladding Parameters Using Full-Factorial Design of Experiment
L. Chan ; I. Shyha ; D. Dryer ; J. Hamilton
Pub. info.: 4th Asia Conference on Mechanical and Materials Engineering.  pp.54-58,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 880
8.

Conference Proceedings
Conference Proceedings
8. Mixed analog/digital VLSI design and simulation of an adaptive resonance theory (ART) neural network architecture
J.J. Liou ; C.S. Ho ; C.G. Christodoulou ; L. Chan
Pub. info.: Applications and science of artifical neural networks : 17-21 April 1995, Orlando, Florida.  pp.72-83,  1995.  Bellingham, WA.  Society of Photo-optical Instrumentation Engineers
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2492
9.

Conference Proceedings
Conference Proceedings
9. Modeling and Characterization of Negative Bias Temperature Instability in p- Channel MOSFETs
J. Yang ; T. Chen ; S. Tan ; C. Ng ; L. Chan
Pub. info.: Silicon nitride, silicon dioxide, and emerging dielectrics 9.  pp.283-300,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 6(3)