1.

Conference Proceedings
Conference Proceedings
1. Chemical Mechanical Planarization (CMP) Process Windows in Shallow Trench Isolation for Advanced CMOS
Chaterjee, A. ; Kwok, S.P. ; Ali, I. ; Joyner, K. ; Shinn, G. ; Sheng, I.-C.
Pub. info.: Proceedings of the First International Symposium on Chemical Mechanical Planarization.  pp.219-227,  1996.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 96-22
2.

Conference Proceedings
Conference Proceedings
2. CURRENT TRANSPORT MODELING IN AN AMORPHOUS SILICON ANTIFUSE STRUCTURE
Amerasekera, A. ; Kwok, S.P. ; Seitchik, J.
Pub. info.: Amorphous silicon technology, 1993 : Symposium held April 13-16, San Francisco, California, U.S.A..  pp.999-1004,  1993.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 297