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Conference Proceedings

1. Wafer-Level 3D System-on-a-Chip using Dielectric Glue Wafer Bonding and Cu Damascene Inter-Wafer Interconnects

Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K.-W. ; Kraft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraun, E. ; Cale, T.S. ; Gutmann, R.J

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.87-95, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

Conference Proceedings

2. Wafer Bonding Using Low-k Dielectrics aa Bonding Glue in Three-Dimensional Integration

Kwon, Y. ; Lu, J.-Q. ; Gutmann, R.J. ; Kraft, R.P. ; McDonald, J. ; Cale, T.S.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.145-154, 2001. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2001-27

Conference Proceedings

3. Wafer Bonding Using Dielectric Polymer Thin Films in 3D Integration

Kwon, Y. ; Lu, J.-Q. ; Kraft, R.P. ; McDonald, J.F. ; Gutmann, R.J. ; Cale, T.S.

Pub. info.:	Polymer interfaces and thin films : symposium held November 26-30, 2001, Boston, Massachusetts, U.S.A.. pp.231-238, 2002. Warrendale, PA. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	710

Conference Proceedings

4. Characteristics of the on-orbit background of the Chandra X-ray Observatory high-resokution camera

Juda, M. ; Donnelly, R.H. ; Hole, K.T. ; Kenter, A.T. ; Kraft, R.P. ; Murray, S.S. ; Pease, D.O. ; Wilton, C.R.A ; Zombeck, M.V.

Pub. info.:	X-Ray and Gamma-Ray Telescopes and Instruments for Astronomy. Part One pp.112-123, 2003. Bellingham WA. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4851