1.

Conference Proceedings
Conference Proceedings
1. FLIP-CHIP BUMP BONDING RELIABILITY AND PROCESS IMPROVEMENT
Koh, Wei H. ; Mayemura, S. ; Kuipers, W.
Pub. info.: Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A..  pp.437-442,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 203
2.

Conference Proceedings
Conference Proceedings
2. EFFECT OF HIGH TEMPERATURE STRESS ON TITANIUM-TUNGSTEN GOLD THIN FILMS ON ALUMINA
Koh, Wei H. ; Louie, W.
Pub. info.: Thin films : stresses and mechanical properties III : symposium held December 2-5, 1991, Boston, Massachusetts, U.S.A..  pp.623-628,  1992.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 239