1.

Conference Proceedings

Conference Proceedings
Kim, H.-H. ; Lee, S.-K. ; Kim, S.-O. ; Kim, Y.-H. ; Kim, H.J. ; Sohn, Y.-S. ; Yang, H.-S. ; Kim, C.-T. ; Kim, D.H.
Pub. info.: Proceedings of the Second International Symposium on Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues.  pp.126-135,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-8
2.

Conference Proceedings

Conference Proceedings
Kim, H.-H. ; Lee, S.-K. ; Kim, S.-O. ; Kim, Y.-H. ; Kim, H.J. ; Sohn, Y.-S. ; Yang, H.-S. ; Kim, C.-T. ; Kim, D.-H.
Pub. info.: Proceedings of the Second International Symposium on Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues.  pp.148-156,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-8
3.

Conference Proceedings

Conference Proceedings
Lee, K.-B. ; Kwak, N.-J. ; Kim, S.-D. ; Kim, C.-T. ; Fu, J. ; Nahm, M.K. ; Diaz, R. ; Lai, C.S. ; Xu, Z. ; Han, B.B. ; Park, J.-G. ; Jang, W.
Pub. info.: Proceedings of the Second International Symposium on Process Control, Diagnostics, and Modeling in Semiconductor Manufacturing.  pp.333-338,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-9
4.

Conference Proceedings

Conference Proceedings
Oh, S.-J. ; Ku, J.-C. ; Kim, S.-B. ; Kim, S.-D. ; Kim, C.-T.
Pub. info.: ULSI process integration : proceedings of the first international symposium.  pp.177-180,  1999.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-18
5.

Conference Proceedings

Conference Proceedings
Kim, C.-H. ; Hwang, S.-B. ; Yu, S.-H. ; Park, H.-L. ; Kim, C.-T.
Pub. info.: Proceedings of the Thirteenth International Symposium on Chemical Vapor Deposition.  pp.827-835,  1996.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 96-5