1.

Conference Proceedings
Conference Proceedings
1. N Type Dopant Activation behaviors of poly Si1-xGex with Ge contents and activation temperature
Kang, S.-K ; Kim, J.J. ; Kang, H.B. ; Yang, C.W. ; Ahn, T.H. ; Yeo, I.S. ; Lee, T.W. ; Lee, Y.H. ; Ko, D.-H.
Pub. info.: Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology.  pp.268-275,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-17
2.

Conference Proceedings
Conference Proceedings
2. The Eletrical characteristics of W/WNx/poly Si1-xGex and the MOSCAP structures with W/WNx/poly Si1-xGex gates stack
Kang, S.-K ; Kim, J.J. ; Kang, H.B. ; Yang, C.W. ; Ahn, T.H. ; Yeo, I.S. ; Lee, T.W. ; Lee, Y.H. ; Ko, D.-H.
Pub. info.: Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology.  pp.276-283,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-17
3.

Conference Proceedings
Conference Proceedings
3. Dry Oxidation Behavior of Epitaxial Si0.7Ge0.3 Films
Kang, H.B. ; Choi, J.K. ; Lee, J.W. ; Yang, C.W.
Pub. info.: Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003.  pp.361-364,  2004.  Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 449-452
4.

Conference Proceedings
Conference Proceedings
4. A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM
Choi, J.K. ; Kang, H.B. ; Lee, J.W. ; Jung, S.B. ; Yang, C.W.
Pub. info.: Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003.  pp.405-408,  2004.  Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 449-452