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11 results

Conference Proceedings

1. Mechanical Properties of Copper Hollow Sphere Manufactured by Sintering Process

Koo, J.M. ; Jung, S.B.

Pub. info.:	Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China. pp.730-733, 2006. Uetikon-Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	510-511

Conference Proceedings

2. Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock

Noh, B.I. ; Jung, S.B.

Pub. info.:	Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China. pp.558-561, 2006. Uetikon-Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	510-511

Conference Proceedings

3. Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength

Kim, J.W. ; Jung, S.B.

Pub. info.:	Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China. pp.546-549, 2006. Uetikon-Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	510-511

Conference Proceedings

4. TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Yoon, J.W. ; Jung, S.B.

Pub. info.:	Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China. pp.554-557, 2006. Uetikon-Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	510-511

Conference Proceedings

5. Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps

Kim, D.G. ; Ha, S.S. ; Jung, S.B.

Pub. info.:	Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China. pp.550-553, 2006. Uetikon-Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	510-511

Conference Proceedings

6. Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints

Kim, J.W. ; Yoon, J.W. ; Jung, S.B.

Pub. info.:	Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003. pp.897-900, 2004. Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	449-452

Conference Proceedings

7. Electrical Properties of G4-48azo Dendrimer Containing Azobenzene Functional Groups

Jung, S.B. ; Yang, K.S. ; Yoo, S.Y. ; Kim, C.K. ; Lee, B.J. ; Kwon, Y.S.

Pub. info.:	Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003. pp.913-916, 2004. Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	449-452

Conference Proceedings

8. Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging

Yoon, J.W. ; Lee, C.B. ; Jung, S.B.

Pub. info.:	Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003. pp.893-896, 2004. Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	449-452

Conference Proceedings

9. Characteristics of ZnO Thin Film by Atomic Layer Deposition for Film Bulk Acoustic Resonator

Kim, S.G. ; Jung, S.B. ; Oh, J.H. ; Kim, H.J. ; Shin, Y.H.

Pub. info.:	Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003. pp.977-980, 2004. Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	449-452

10.

Conference Proceedings

10. Effect of PWHT on Behaviors of Precipitates and Hardness Distribution of 6061 Al Alloy Joints by Friction Stir Welding Method

Lee, W.B. ; Jang, H.S. ; Yeon, Y.M. ; Jung, S.B.

Pub. info.:	Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003. pp.601-604, 2004. Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	449-452

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Author: Jung, S.B.