1.

Conference Proceedings
Conference Proceedings
1. Fabrication of Sub-micron Active Layer SSOI Substrates using Ion Splitting And Wafer Bonding Technologies
Ruddell, F. ; Bain, M. ; Suder, S. ; Hurley, R.E. ; Armstrong, B.M. ; Fusco, V.F. ; Gamble, H.S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.25-30,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. Fabrication of sub-micron active layer SSOI substrates using ion splitting and wafer bonding technologies
Ruddell, F.H. ; Rain, M.F. ; Suder, S. ; Hurley, R.E. ; Armstrong, R.M. ; Fusco, V.F. ; Gamble, H.S.
Pub. info.: Silicon-on-insulator technology and devices XI : proceedings of the international symposium.  pp.57-62,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-5