1.

Conference Proceedings
Conference Proceedings
1. A Nano-thick SOI Fabrication Method
Huang, C.-H. ; Cheng, J.T. ; Hsu, Y.-K. ; Chang, C.-L. ; Wang, H.W. ; Lee, S.-L. ; Lee, T.-H.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.431-438,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
2.

Conference Proceedings
Conference Proceedings
2. Thermal-Microwave Hybrid SOI Materials Technology
Cheng, J.T. ; Huang, C.-H. ; Hsu, Y.-K. ; Chang, C.-L. ; Wang, H.-W. ; Gan, G. ; Lee, S.-L. ; Lee, T.-H.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.414-423,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
3.

Conference Proceedings
Conference Proceedings
3. Study the enhancement of near electro-magnetic field via plasmonic effects using finite-difference time-domain methods and near-field scanning optical microscopy [6323-37]
Huang, C.-H. ; Lin, C.-Y. ; Chen, S.-J.
Pub. info.: Plasmonics: Metallic Nanostructures and their Optical Properties IV.  pp.632310-632310,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6323
4.

Technical Paper
Technical Paper
4. Fabrication of NiAI Intermetallic Reactors for Microtechnology-Based Energy Chemical Systems (MECS).
Huang, C.-H.
Pub. info.: SME technical paper.  2001.  Society of Manufacturing Engineers