1.

Conference Proceedings
Conference Proceedings
1. Dry Etch and Process Integration: Development of 0.18 μm Production DRAM Process
Donohoe, K.G. ; Howard, B.J. ; Hillyer, L.
Pub. info.: ULSI process integration : proceedings of the first international symposium.  pp.345-346,  1999.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-18
2.

Conference Proceedings
Conference Proceedings
2. Experimental Study of Geometry Structure Dependent Charging of the Dielectric Surface during Plasma Etching
Abatchev, M.K. ; Howard, B.J. ; Donohoe, K.G. ; Blalock, G.T.
Pub. info.: Plasma processing XIII : proceedings of the international symposium.  pp.160-167,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-6
3.

Conference Proceedings
Conference Proceedings
3. REACTIVE ION ETCHING OF COPPER WITH SiCl4 AND CCl2F2
Howard, B.J. ; Wolterman, S.K. ; Yoo, W.J. ; Gittleman, B. ; Steinbruchel, Ch.
Pub. info.: Surface chemistry and beam-solid interactions : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A..  pp.129-134,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 201