1.

Conference Proceedings
Conference Proceedings
1. Si/Si Interface Bonded at Room Temperature by Ar Beam Surface Activation
Takagi,H. ; Maeda,R. ; Hosoda,N. ; Suga,T.
Pub. info.: Intergranular and interphase boundaries in materials : iib98 : proceedings of the 9th International Conference on Intergranular and Interphase Boundaries in Materials (iib98), held in Prague, Czech Republic, July, 1998.  pp.341-344,  1999.  Zurich-Uetikon, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 294-296
2.

Conference Proceedings
Conference Proceedings
2. Microstructure of Al/α-Al2O3 Interface Fabricated by Surface Activated Bonding at Room Temperature
Akatsu,T. ; Hosoda,N. ; Suga,T. ; Ruhle,M.
Pub. info.: Intergranular and interphase boundaries in materials : iib98 : proceedings of the 9th International Conference on Intergranular and Interphase Boundaries in Materials (iib98), held in Prague, Czech Republic, July, 1998.  pp.329-332,  1999.  Zurich-Uetikon, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 294-296