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11 results

Conference Proceedings

1. LOW TEMPERATURE PL CHARACTERIZATION OF LPEE GROWN GaSb AND GaInAsSb EPILAYERS

Iyer, S. ; Hegde, S. ; Bajaj, K.K. ; Abul-Fadl, Ali ; Mitchel, W.

Pub. info.:	Infrared detectors : materials, processing, and devices : symposium held April 14-16, 1993, San Francisco, California, U.S.A.. pp.41-46, 1994. Pittsburgh, PA. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	299

Conference Proceedings

2. Integrated Variable Reluctance Magnetic Mini-Motor

Acosta, R.E. ; Ahn, C. ; Babich, I.V. ; Chainer, T.J. ; Cooper, E.I. ; Cotte, J.M. ; Horkans, W.J. ; Hegde, S. ; Jahnes, C. ; Krongeib, S. ; Kwietniak, K.T. ; LaBianca, N.C. ; O'Sullivan, E.J.M. ; Pomerene, A.T. ; Rath, D.L. ; Romankiw, L.T. ; Tomello, J.A.

Pub. info.:	Proceedings of the Fourth International Symposium on Magnetic Materials, Processes, and Devices : applications to storage and microelectromechanical systems (MEMS). pp.508-520, 1995. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	95-18

Conference Proceedings

3. 14 Dose loss and diffusion in BF2-implanted silicon during Rapid Thermal Annealing

Dokumaci, O. ; Ronsheim, P. ; Hegde, S. ; Cobral, C., Jr.

Pub. info.:	Advanced short-time thermal processing for Si-based CMOS devices : proceedings of the international symposium. pp.105-110, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-14

Conference Proceedings

4. Nitrogen Implantation and Diffusion in Silicon

Adam, L. S. ; Law, M. E. ; Dokumaci, O. ; Haddara, Y. ; Murthy, C. ; Park, H. ; Hegde, S. ; Chidambarrao, D. ; Mollis, S. ; Domenicucci, T. ; Dziobkowski, C. ; Jones, K. ; Wong, P. ; Young, R. ; Srinivasan, R.

Pub. info.:	Si front-end processing - physics and technology of dopant-defect interactions : symposium held April 6-9, 1999, San Francisco, California, U.S.A.. pp.277-, 1999. Warrendale, PA. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	568

Conference Proceedings

5. Transient Enhanced Diffusion and Dose Loss of Indium in Silicon

Dokumaci, O. ; Ronsheim, P. ; D'emic, C. ; Domenicucci, A. G. ; Hegde, S. ; Kozlowski, P. ; Wong, H-S. P.

Pub. info.:	Si front-end processing - physics and technology of dopant-defect interactions : symposium held April 6-9, 1999, San Francisco, California, U.S.A.. pp.205-, 1999. Warrendale, PA. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	568

Conference Proceedings

6. Diffusion Barriers for Mobile Ions in 256M DRAMs

Gambino, J. P. ; Parks, C. C. ; Hegde, S. ; Domenicucci, A. G.

Pub. info.:	Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A.. pp.229-, 1999. Warrendale, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	564

Conference Proceedings

7. ION IMPLANTATION DAMAGE AND ANNEALING IN GaSb

Iyer, S. ; Parakkat, R. ; Patnaik, B. ; Parikh, N. ; Hegde, S.

Pub. info.:	Materials synthesis and processing using ion beams : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A.. pp.185-, 1994. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	316

Conference Proceedings

8. High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems (Invited Paper)

Chang, G. -K. ; Guidotti, D. ; Huang, Z. R. ; Wan, L. ; Yu, J. ; Hegde, S. ; Kuo, H. -F. ; Chang, Y, -J. ; Liu, F. ; Wang, F. ; Tummala, R.

Pub. info.:	Enabling photonics technologies for defense, security, and aerospace applications : 31 March-1 April 2005, Orlando, Florida, USA. pp.176-190, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5814

Technical Paper

9. Interoperability Challenges in Automotive Embedded Software.

Sampath, A. ; Hegde, S.

Pub. info.:	8th SAEINDIA International Mobility Conference & Exposition and Commercial Vehicle Engineering Congress 2013 (SIMCOMVEC) : SAE technical paper. 2013. Warrendale, Penn.. Society of Automotive Engineers
Title of ser.:	Society of Automotive Engineers technical paper series
Ser. no.:	2013

10.

Technical Paper

10. Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards.

Mahalingam, S. ; Hegde, S. ; Ramakrishna, G. ; Pucha, R. V. ; Sitaraman, S. K.

Pub. info.:	A.S.M.E. paper. 2003. New York, NY. American Society of Mechanical Engineers
Title of ser.:	ASME Technical Paper : IMECE
Ser. no.:	2003

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