1.

Conference Proceedings
Conference Proceedings
1. Role of RIE in microchip bond pad corrosion
Brownson,R. ; Butler,K. ; Cadena,S. ; Detar,M. ; Johnson,I. ; McCoulloch,L. ; McCoulloch,J. ; Mishra,B. ; Healey,J.T. ; Honcik,K. ; Phan,T.T. ; Sterif,T. ; Stevens,H. ; Tovar,A.
Pub. info.: Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II.  pp.95-102,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2874
2.

Conference Proceedings
Conference Proceedings
2. Prevention of auto-doping-induced threshold voltage shifts
Phan,T.T. ; Healey,J.T. ; Kent,W.R.
Pub. info.: Microelectronic Manufacturing Yield, Reliability, and Failure Analysis.  pp.136-144,  1995.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2635
3.

Conference Proceedings
Conference Proceedings
3. Influence of topographical variations on reliable via and contact formation
Healey,J.T. ; Rubel,S.E.
Pub. info.: Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV.  pp.131-145,  1998.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3507
4.

Conference Proceedings
Conference Proceedings
4. Resolving localized oxide breakthrough during poly etch of nonvolatile floating gate structures
Healey,J.T. ; Sim,V. ; Rubel,S.E.
Pub. info.: Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV.  pp.312-320,  1998.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3507